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Laser wire and parts marking, wire stripping and welding for demanding aerospace applications
Apr 13 , 2021
Precision is paramount for the aerospace industry. By minimizing the amount of defective parts, downtime and human error, our industry-leading laser solutions can help you meet your budget targets, as well as critical federal and international specifications. THE ADVANTAGES OF LASER WIRE MARKING According to SAE standards, aerospace wiring must be marked every three inches. Our lasers provide a hi...
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355nm nanosecond UV laser machine coding food packaging bag production date and shelf life
Apr 14 , 2021
355nm nanosecond UV laser machine coding food packaging bag production date and shelf life Because of its unique high-definition visual effect, non-erasable, anti-counterfeiting, and anti-sweeping features, food packaging laser coding can complete the assembly line marking the product date and batch number of food packaging in less than 1 second, which greatly improves production With effic...
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On-the-fly uv laser processing for extruded parts
Apr 14 , 2021
Extrusion is a high-volume manufacturing process, during which raw materials are melted and formed into continuous profiles. It produces items like PVC pipe and other tubing, window frames, thermoplastic coatings, wire insulation and more. Many of these products require high-speed, accurate part marking, cutting and drilling—making laser technology a perfect fit. LASER PROCESSING FOR ...
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Plastic Laser welding places less stress on weld pieces
Apr 14 , 2021
Laser welding places less stress on weld pieces ADVANTAGES Seam quality. Lasers achieve excellent weld seam structure with no secondary finishing required. Non-contact. Laser welding places less stress on weld pieces. It also eliminates tooling replacements due to wear and tear. Cleanliness. Lasers don’t require filler materials or additives and leave virtually no debris. Precision. A ...
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355nm UV laser for automatic marking of QR code on PCB/FPCB surface
Apr 15 , 2021
355nm UV laser for automatic marking of QR code on PCB/FPCB surface PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of FPC flexible boards, Precision, better applicat...
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Internal and external green laser marking of glass
Apr 15 , 2021
Whether you need an internal mark or surface etching, our laser glass marking systems can meet your needs. Due to its many advantages over traditional marking techniques, laser marking is found in an increasing number of industries—bringing flexibility, speed and repeatability to your application. Other advantages include: No consumables. Laser marking doesn’t require extra cons...
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0.02mm high-precision S9 UV laser is more suitable for PE film date printing
Apr 16 , 2021
0.02mm high-precision S9 UV laser is more suitable for PE film date printing PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). PE film can be used a...
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Cold light source UV laser can avoid heat deformation of PE film when marking date
Apr 16 , 2021
Cold light source UV laser can avoid heat deformation of PE film when marking date PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). PE film can be ...
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S9 ultraviolet laser is especially suitable for PE film coding, with high light stability
Apr 16 , 2021
S9 ultraviolet laser is especially suitable for PE film coding, with high light stability PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). P...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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