532 Green Laser is the solution for scribing, cutting and marking silicon wafers
The 532 Green Laser is the solution for scribing, cutting and marking silicon wafers.
The process of scribing and marking a silicon wafer is complicated, but for RFH Green Laser it is a simple task. The use of green laser marking in the production of RFH can contract a series of work, as long as you debug, scribing, cutting and marking all can be solved. In addition, the accuracy and smoothness of marking and cutting can be ensured. In marking, the characters and patterns can be clearly carved on the silicon wafer and not easily blurred.