RFH 3W5W laser solves the problem of wafer scribing, cutting and marking at one time UV laser marking machine manufacturers buy UV lasers for wafer micro-hole and blind hole processing   Wafer-scribing cutting and marking process are complicated. Ordinary cutting and marking technology can not meet the scribing process of wafer, micro-holes and blind hole processing, but RFH UV laser can easily do the work.   RFH's UV laser can solve all the problems of scribing, cutting and marking on the wafer at one time, and can absolutely guarantee the accuracy of dots during scribing and the smoothness of the cutting board. At the same time, RFH's UV laser can clearly etch text or patterns on silicon wafers during marking.

3W5W laser marks Phone Chargers & Cables is smooth and no residue. The UV solid-state laser marking Phone Chargers & Cables shell developed and produced by RFH can be clean, smooth and free of traces, and the text and graphics formed by the marking are complete and clear, which can highlight its brand and quality to a greater extent. RFH UV lasers have three distinctive features: fast speed, high precision, and high stability. This type of laser etching technology cannot even be compared with fiber lasers.